Vacuum Reflow Oven Soldering Machine

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Product Description

The Vacuum Reflow Oven Soldering Machine is an advanced, high-precision soldering solution engineered for demanding SMT (Surface Mount Technology) PCB assembly lines. By performing the reflow soldering process in a controlled vacuum environment, this machine effectively eliminates air pockets, reduces oxidation, and minimizes void formation in solder joints — resulting in superior joint integrity, mechanical strength, and electrical performance.

Designed for high-throughput, high-reliability production, the machine features a three-stage transport system (heating zone, vacuum zone, and cooling zone), an automatic furnace lid opening system for easy maintenance, and PLC-based precise process control. Its three-phase 380V power supply and 1,000W rated capacity deliver consistent, energy-efficient performance across diverse PCB formats — from consumer electronics to automotive, aerospace, and medical device applications.

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Categories: Soldering solutions, Reflow oven

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Key Features

Key Feature	Description
Vacuum Soldering Environment	Performs reflow soldering under vacuum (as low as 2 mbar), effectively eliminating voids, air inclusions, and oxidation — delivering defect-free, high-reliability solder joints critical for automotive, aerospace, and medical electronics.
Three-Stage Transport System	Independent heating zone, vacuum zone, and cooling zone allow individually adjustable process control for each stage — ensuring optimal thermal profile, void reduction, and safe board cooling in a single continuous pass.
Automatic Furnace Lid Opening	Motorized automatic lid opening system on the vacuum chamber facilitates quick, safe access for cleaning, maintenance, and changeover — minimizing downtime and improving operational efficiency.
5 HP Water Cooling System	Equipped with a high-performance 5 HP water cooler for the cooling zone, ensuring rapid and uniform heat dissipation from PCBs after soldering to prevent thermal stress and component damage.
Efficient Flux Recovery System	Integrated flux recovery and management system prevents rosin residue buildup inside the chamber — reducing cleaning frequency and maintaining process cleanliness.
Fast Production Cycle	Average production cycle of 40–60 seconds per board enables high-throughput continuous production, meeting the demands of both small-batch and large-volume SMT lines.
PLC + PC Control System	Dual-architecture control (PLC + computer interface) with vacuum profile editing capability, real-time monitoring, and data logging for full traceability and process repeatability.
Lead-Free & RoHS Compliant	Fully supports lead-free (SAC alloy) soldering processes in compliance with RoHS and international environmental standards, as well as traditional Sn-Pb processes where required.

Technical Specifications

Specification	Details
Voltage	380 V
Type	Automatic Solders (Vacuum Reflow)
Condition	New
Warranty	1 Year
Rated Capacity	1000 W
Current	100 A
Place of Origin	Guangdong, China
Brand Name	Jaguar
Machine Dimensions	6600 × 1670 × 1570 mm
Machine Weight	4300 kg
Vacuum Degree	1 ~ 10 mbar
Belt Width	500 mm
Heating Time	45 minutes
Transport Speed	300 – 2,000 mm/min
Heating Zones	UP 10 / BOTTOM 10 (20 zones total)
Heating Zone Length	3,500 mm
Transport System	Three-stage: Heating Zone → Vacuum Zone → Cooling Zone
Production Cycle	40 – 60 seconds (average)
Cooling System	5 HP Water Cooler
Control System	PLC + PC / Touch Screen
Solder Type	Lead-Free (SAC) / Sn-Pb
Certification	CE, ISO 9000, RoHS

Packaging & Delivery

Parameter	Details
Selling Units	Single item
Single Package Size	7360 × 1870 × 1660 cm
Single Gross Weight	4600.000 kg
Packaging Type	Vacuum package and plywood case

Applications

High-reliability SMT PCB assembly requiring void-free solder joints (BGA, QFN, LGA packages)
Automotive ECU, power module, LED lighting, and EV battery management system PCB soldering
Aerospace and defense electronics requiring MIL-spec solder joint integrity
Medical device PCB assemblies where joint reliability is safety-critical
Power electronics: IGBT modules, DC-DC converters, power supply assemblies
Telecommunications and 5G infrastructure equipment PCB production
Industrial automation control boards, relay modules, and sensor assemblies
Consumer electronics, smart devices, and IoT hardware manufacturing