12 Zones Lead-free Hot Air Reflow Oven F12

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Product Description

The JAGUAR F12 is a large-capacity, 12-zone lead-free hot air reflow oven engineered for high-throughput SMT (Surface Mount Technology) and PCBA production lines. Featuring 24 independent heating elements (12 top / 12 bottom), the F12 delivers exceptional temperature uniformity and thermal stability across the full PCB width — making it ideal for complex, high-density assemblies in demanding industrial environments.

Powered by a Siemens PLC + professional IPC (Industrial PC) dual-control architecture running on Windows 7, the F12 combines precision process control with a user-friendly bilingual interface. Its new energy-saving furnace design with 4-sided return air circulation, plug-in high-temperature motors, and forced air cooling system ensure consistent, high-quality lead-free solder joints with maximum production uptime.

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Categories: Soldering solutions, Reflow oven

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Key Features

Key Feature	Description
12-Zone Heating System (24 Elements)	12 independent heating zones with 24 elements (UP 12 / BOTTOM 12), each with individual temperature and switch control. Provides the precise thermal profiling required for complex BGAs, QFNs, and mixed-component assemblies.
New Energy-Saving Furnace Design	4-sided return air circulation design ensures optimal hot air convection, best-in-class temperature uniformity (±1~2°C), and faster thermal compensation — reducing energy consumption during continuous production.
Plug-In High-Temperature Motors	Imported plug-in type high-temperature motors allow quick replacement in under 5 minutes, minimizing maintenance downtime and ensuring continuous production reliability.
Siemens PLC + IPC Control System	Dual-architecture control: Siemens PLC for real-time machine performance, combined with a professional Industrial PC (IPC) running Windows 7. If IPC crashes, PLC continues offline — production is never interrupted.
Mesh & Chain Conveyor System	Precision mesh and chain transmission controlled by computer for smooth, shake-free PCB transport. Stepless frequency converter speed control (0.35–1.5 m/min), accuracy ±2 mm/min. Rail width adjustable 50–400 mm.
Forced Air Dual Cooling Zones	2 independent cooling zones (UP 2 / BOTTOM 2) with axial fan forced air cooling ensure rapid, uniform heat dissipation from boards after reflow — preventing component thermal stress and deformation.
Automatic Cylinder Body Lifting	The furnace body lifts automatically via cylinder for safe, convenient access to the internal heating chamber for inspection, cleaning, and maintenance.
UPS & Auto Delay Shutdown	Built-in UPS and automatic delay shutdown system protect PCBs and the machine in the event of power failure or overheat — preventing component damage and ensuring safe shutdowns.
Nitrogen Option Available	Optional nitrogen atmosphere module for oxide-free, void-minimized soldering — suitable for high-reliability applications requiring inert atmosphere reflow.
Comprehensive Alarm System	Multi-mode alarms: abnormal temperature (extra-high / extra-low), board-dropped alarm, and 3-color tower light (Yellow = Warning, Green = Normal, Red = Abnormal) for clear operator visibility.

Technical Specifications

Specification	Details
Model	JAGUAR F12
Machine Type	Lead-Free Hot Air Reflow Oven
Heating Zones	UP 12 / BOTTOM 12 (24 elements total)
Heating Zone Length	4,640 mm
Heating Mode	Hot Air (Forced Circulation)
Cooling Zones	UP 2 / BOTTOM 2
Cooling Mode	Forced Air Cooling
Exhaust Volume	10 m³/min × 2 exhausts
Max. PCB Width	400 mm
Mesh Belt Width	450 mm
Rail Width Range	50 – 400 mm
Conveyor Speed	0 – 2,000 mm/min (0.35 – 1.5 m/min)
Speed Accuracy	±2 mm/min
Conveyor Direction	Left to Right (Right to Left optional)
Conveyor Height	900 ± 20 mm
Transmission Type	Mesh belt and chain
Component Clearance	Top and bottom 25 mm
Power Supply	5-line, 3-phase 380V 50/60 Hz
Total Power	56 kW
Starting Power	48 kW
Normal Power Consumption	12 kW
Warm-up Time	~20 minutes
Temp. Setting Range	Room temperature to 300°C
Temp. Control Method	PID closed-loop control & SSR driving
Temp. Control Precision	±1°C
Temp. Deviation on PCB	±2°C
Control System	Siemens PLC + Professional IPC
OS / Interface	Windows 7; Chinese & English bilingual
Data Storage	Process data and status storage (80 GB)
Nozzle Plate	Aluminum Alloy
Machine Dimensions (L×W×H)	~6,600 × 1,420 × 1,580 mm
Machine Weight	~2,000 kg
Color	Computer Gray
Condition	New
Nitrogen Option	Available (optional)
Certification	CE, CCC, ISO 9000, RoHS
Warranty	12 Months
Place of Origin	Shenzhen, Guangdong, China

Applications

High-volume SMT PCB assembly lines requiring precise, repeatable thermal profiling
Lead-free soldering of BGA, QFN, LGA, and fine-pitch surface-mount components
Mixed-technology PCB assembly (SMT + THT) with complex thermal requirements
Automotive electronics: ECUs, ADAS modules, LED lighting, and EV battery management PCBs
Aerospace and defense high-reliability PCB assemblies
Medical device PCBs requiring strict temperature control and process traceability
Industrial automation control boards, power electronics, and relay module assemblies
Telecommunications, networking, and 5G infrastructure PCB production
LED driver boards, display panels, and consumer electronics manufacturing