JAGUAR N200 Manual Mini Wave Soldering Machine

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Product Description

The JAGUAR N200 is a compact, cost-effective manual mini wave soldering machine engineered for DIP (Through-Hole) PCB assembly, prototype production, and AI PCB processing lines. Combining automatic conveying, PLC-controlled flux spraying, and infrared preheating in a space-saving footprint, the N200 delivers reliable, consistent solder joint quality for a wide range of small-to-medium production volumes.

Designed with simplicity and reliability in mind, the N200 features an independent titanium alloy solder pot, Japanese scanning spray nozzle flux system, and a PID+SSR temperature control system — all in a compact 2,100 × 1,200 mm overall footprint. It supports both lead-free (SAC) and Sn-Pb processes, making it a versatile entry-point machine for any PCB assembly operation requiring wave soldering capability.

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Categories: Soldering solutions, Wave Soldering Machine

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Key Features

Key Feature	Description
Automatic Conveying Power System	Fully automated conveying with auto synchronous board feeding functions, ensuring smooth and consistent PCB flow through the machine without manual intervention.
Japanese Scanning Spray Flux System	Transverse scanning spray nozzle system using premium Japanese nozzles with rodless pneumatic cylinder and PLC control — delivering precise, even flux application every cycle.
IR Ceramic Preheating (1 Zone)	Remote infrared ceramic heating pipe preheating system provides efficient, direct heat radiation to the PCB bottom — fast ramp-up to 150°C in ~10–15 minutes and thorough flux activation.
Frequency-Converter Wave Crest Drive	Solder pot peak uses imported high-frequency conversion motor with independent control and stepless frequency converter speed adjustment — precise, independent wave height control for consistent solder joints.
Titanium Alloy Solder Pot	Solder pot constructed from titanium alloy for superior resistance to tin corrosion and adhesion — extended pot lifespan, lower maintenance costs, and cleaner solder quality vs. standard cast iron.
Special Alloy Conveyor Fingers	Non-stick tin, reinforced double V-groove special alloy chain claw fingers ensure reliable PCB transport and clean solder joint quality with minimal contamination risk.
PID + SSR Temperature Control	PID closed-loop temperature control combined with SSR (Solid State Relay) driving for the solder pot — precise, stable temperature maintenance up to 300°C with ±1°C accuracy.
PLC Control System	PLC-based control with press-key operation as standard; optional touch screen or full PC control upgrade available for enhanced process parameter management and data traceability.
UPS & Fault Alarm System	Built-in fault diagnosis and audible/visual alarm system with automatic delay shutdown protection — prevents PCB and machine damage during abnormal conditions or power interruptions.
Lead-Free & Sn-Pb Compatible	Supports both lead-free (SAC alloy) and traditional Sn-Pb soldering processes with an independently designed, easy-to-clean solder furnace compliant with RoHS requirements.

Technical Specifications

Specification	Details
Model	JAGUAR N200
Machine Type	Manual Mini Wave Soldering Machine (Lead-Free / Sn-Pb)
Condition	New
Warranty	12 Months
Preheating Zones	1 zone
Preheating Zone Length	450 mm
Preheating Method	IR Infrared Ceramic (standard); Hot Air optional
Preheating Power	220V / 5 kW
Preheating Time	~10–15 min to reach 150°C
Temp. Setting Range	Room temperature to 300°C
Solder Type	Lead-Free (SAC) / Sn-Pb
Solder Pot Capacity	180 kg
Solder Pot Material	Titanium Alloy
Solder Pot Temperature	Up to 300°C
Solder Power	380V / 6 kW
Solder Temp. Control	PID + SSR dual control
Wave Crest Drive Power	220V / 500 W
Solder Warm-up Time	~120 min to reach 250°C
PCB Width	50 – 250 mm
Conveyor Speed	300 – 1,800 mm/min
Conveyor Direction	Left to Right (Right to Left optional)
Conveyor Angle	4 – 7°
Component Lead Clearance	Within 10 mm
Flux System	Japanese scanning spray nozzle, rodless pneumatic cylinder, PLC controlled
Flux Pressure	3 – 5 bar
Flux Tank Capacity	3.2 L
Power Supply	3-phase 380V / 50–60 Hz
Total Power	9 kW
Running Power	3 – 5 kW
Air Supply	0.5 MPa
Control Method	Press Key + PLC (Touch Screen / PC optional)
Body Dimensions (L×W×H)	1,400 × 1,200 × 1,600 mm
Overall Dimensions (L×W×H)	2,100 × 1,200 × 1,600 mm
Machine Weight	500 kg
Certification	CE, CCC, ISO 9000, RoHS
Place of Origin	Shenzhen, Guangdong, China

Model Comparison: N200 vs. N250

Parameter	N200 (This Model)	N250 (Upgraded)
PCB Width	50 – 250 mm	50 – 300 mm
Solder Pot Capacity	180 kg	220 kg
Preheating Zones	1 zone / 450 mm	2 zones / 800 mm
Overall Dimensions	2,100 × 1,200 × 1,600 mm	2,600 × 1,200 × 1,600 mm
Machine Weight	500 kg	700 kg
Best For	Compact lines, smaller PCBs, AI/prototype runs	Mid-volume DIP lines, wider boards

Applications

Through-hole (DIP) component soldering for small-to-medium volume PCB assembly lines
AI PCB processing and prototype/R&D board soldering requiring compact, flexible equipment
Manual and semi-automated PCB soldering in space-constrained production environments
Consumer electronics: IoT modules, smart home devices, remote controls, LED driver boards
Industrial control boards, sensor modules, relay assemblies, and power supply PCBs
Automotive electronics: small ECU boards, sensor PCBs, and lighting module assemblies
Telecommunications and networking equipment PCB through-hole soldering
Educational, training, and low-volume contract manufacturing (EMS/PCBA services)