Product overview IBM-ER3042 Two-Component Epoxy

IBM-ER3042 is a two-component epoxy adhesive designed for bonding and sealing electronic components. It provides excellent electrical insulation, heat resistance, moisture resistance, and chemical resistance. The cured product exhibits outstanding mechanical properties and strong adhesion to various substrates, while being environmentally friendly and pollution-free.

Technical specifications

Property	Unit	Value
Density @25 °C	g/cm³	1.1
Mixed Viscosity @25 °C	mPa·s	≤ 3000
Working Time @25 °C	min	≥ 20
Tack-free Time @25 °C	h	≤ 4
Full Cure Time @25 °C	h	≤ 36
Light Transmittance (2 mm thick)	%	≥ 90
Tensile Strength	MPa	≥ 50
Shear Strength	MPa	≥ 50
Hardness (Shore D)	Shore D	60–70
Elongation	%	2
Initial Adhesion (SUS)	MPa	≥ 10
85 °C / 85 % RH, 168 h		No change
Thermal Shock −20 °C / 100 °C, 100 cycles		No change

Applications

• Electronics: Bonding and sealing electronic components, potting, insulation, and moisture protection.

• Manufacturing: Fixing metal, plastic, ceramics, glass, composite materials, and structural parts.

• Automotive & Machinery: Repairing cracks, filling gaps, reinforcing parts, and ensuring vibration resistance.

• Household Use: DIY repairs, bonding household items, and general maintenance.

• Handicrafts: Craft bonding, model making, and handmade projects requiring strong adhesion.

See also: CHUERA 969D Soldering Station, SN63PB37 Rosin Core Solder Wire – Leaded , JIT-Asia

Product Manual

IBM-ER3042 Two-Component Epoxy